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MARTIN SMT VD90.5010

Solder Pellets, for BGA Reballing, 0.45 mm, 183 °C, 20 g

MARTIN SMT VD90.5010
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Manufacturer Part No:
VD90.5010
Order Code:
2352929
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Technical Datasheet:
VD90.5010   Datasheet
ECAD / MCAD
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Product Information

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:
63, 37 Sn, Pb

:
183°C

:
0.45mm

:
20g

:
0.705oz

:
TUK SGACK902S Keystone Coupler

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Technical Documents (2)

Product Overview

The VD90.5010 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It's material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good.
  • ±10µm tolerance
  • 99.9% purity

Applications

Maintenance & Repair, Industrial

Available for back order

More stock available to supplier lead times which is approximately 27/5/24

Due to market conditions delivery times are for general guidance only and may be subject to change at short notice

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S$314.47 ( S$342.77  Inc. GST)

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