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Quantity | Price (inc GST) |
---|---|
1+ | S$14.890 (S$16.2301) |
10+ | S$13.820 (S$15.0638) |
25+ | S$13.180 (S$14.3662) |
50+ | S$11.980 (S$13.0582) |
100+ | S$11.720 (S$12.7748) |
Product Information
Product Overview
AS4C256M16D4-83BCN is a 256M x 16bit DDR4 synchronous DRAM (SDRAM). The DDR4 SDRAM is a high-speed dynamic random-access memory internally organized with eight-banks (2 bank groups each with 4 banks). The DDR4 SDRAM uses a 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM core and eight corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write operation to the DDR4 SDRAM are burst oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration of an activate command, which is then followed by a read or write command.
- JEDEC standard compliant, supports JEDEC clock jitter specification, auto refresh and self refresh
- Power supplies: VDD and VDDQ = +1.2V ±0.06V, VPP = +2.5V -0.125V / +0.25V
- Bidirectional differential data strobe, DQS &DQS#, differential clock, CK and CK#
- 8 internal banks: 2 groups of 4 banks each, separated IO gating structures by bank group
- 8n-bit prefetch architecture, precharge and active power down, auto refresh and self refresh
- Low-power auto self refresh (LPASR), self refresh abort, fine granularity refresh
- Write levelling, DQ training via MPR, command/address (CA) parity, boundary scan mode
- Per DRAM addressability (PDA), output driver impedance control, dynamic on-die termination (ODT)
- ZQ calibration, command/address latency (CAL), asynchronous reset, DLL enable/disable
- 1200MHz max clock, 96-ball FBGA package, commercial (extended) temperature range from 0 to 95°C
Technical Specifications
DDR4
256M x 16bit
FBGA
1.2V
0°C
-
4Gbit
1.2GHz
96Pins
Surface Mount
95°C
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate