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Quantity | Price (inc GST) |
---|---|
1+ | S$72.030 (S$78.5127) |
5+ | S$70.590 (S$76.9431) |
10+ | S$69.150 (S$75.3735) |
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S$72.03 (S$78.51 inc GST)
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Product Information
ManufacturerBERGQUIST
Manufacturer Part NoGAP PAD TGP 2700
Order Code8783519
Technical Datasheet
Thermal Conductivity2.7W/m.K
Conductive MaterialFilled Silicone Polymer
Thickness3.18mm
Thermal Impedance0.74°C/W
Dielectric Strength-
External Length101.6mm
External Width101.6mm
Product Range-
SVHC0
Product Overview
Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is ideal for applications where you need high thermal performance and high conformability from a non reinforced pad that is inherently tacky.
- Eliminates air gaps to reduce thermal resistance
- Highly conformable to reduce interfacial resisitance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
- Supplied in a 100 x 100mm sheet
Technical Specifications
Thermal Conductivity
2.7W/m.K
Thickness
3.18mm
Dielectric Strength
-
External Width
101.6mm
SVHC
0
Conductive Material
Filled Silicone Polymer
Thermal Impedance
0.74°C/W
External Length
101.6mm
Product Range
-
Technical Docs (3)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85479000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:0
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.108862