
| Manufacturer | INTEGRATED SILICON SOLUTION / ISSI |
|---|---|
| Manufacturer Part No | IS66WVE4M16EBLL-70BLICopy |
| Manufacturer Standard Lead Time | 26 weeks |
| Order Code | 2901210 |
| Your Part Number | |
| Technical Datasheet |
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| Quantity | Price (inc GST) |
|---|---|
| 1+ | S$10.950 (S$11.9355) |
Product Information
| Manufacturer | INTEGRATED SILICON SOLUTION / ISSI |
|---|---|
| Manufacturer Part No | IS66WVE4M16EBLL-70BLICopy |
| Manufacturer Standard Lead Time | 26 weeks |
| Order Code | 2901210 |
| Technical Datasheet | |
| SRAM Type | Pseudo SRAM |
| Memory Density | 64Mbit |
| Memory Configuration | 4M x 16bit |
| IC Case / Package | TFBGA |
| No. of Pins | 48Pins |
| Supply Voltage Min | 2.7V |
| Supply Voltage Max | 3.6V |
| Supply Voltage Nom | - |
| Clock Frequency Max | - |
| IC Mounting | Surface Mount |
| Operating Temperature Min | -40°C |
| Operating Temperature Max | 85°C |
| Product Range | - |
| MSL | MSL 3 - 168 hours |
| SVHC | No SVHC (16-Jul-2019) |
Product Overview
IS66WVE4M16EBLL-70BLI is a 64Mb async/page PSRAM. It is an integrated memory device containing 64Mbit pseudo static random access memory using a self-refresh DRAM array organized as 4M words by 16bits. The device includes several power saving modes : partial array refresh mode where data is retained in a portion of the array and deep power down mode. Both these modes reduce standby current drain. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. It include the industry-standard, asynchronous memory interface found on other low-power SRAM or pseudo-SRAM (PSRAM) offerings. For seamless operation on an asynchronous memory bus, PSRAM products incorporated a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance.
- Dual voltage rails for optional performance, VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
- 4Mx16 configuration, 70ns speed
- Asynchronous operation is <lt/>30mA, intrapage read is <lt/>23mA
- Standby is <lt/>200uA (max.) at -40°C~85°C, deep power-down (DPD) is <lt/>10µA (typ)
- Temperature controlled refresh, partial array refresh, deep power-down (DPD) mode
- 48-ball TFBGA package
- Industrial temperature rating range from -40°C to +85°C
Technical Specifications
| SRAM Type | Pseudo SRAM |
|---|---|
| Memory Configuration | 4M x 16bit |
| No. of Pins | 48Pins |
| Supply Voltage Max | 3.6V |
| Clock Frequency Max | - |
| Operating Temperature Min | -40°C |
| Product Range | - |
| SVHC | No SVHC (16-Jul-2019) |
| Memory Density | 64Mbit |
|---|---|
| IC Case / Package | TFBGA |
| Supply Voltage Min | 2.7V |
| Supply Voltage Nom | - |
| IC Mounting | Surface Mount |
| Operating Temperature Max | 85°C |
| MSL | MSL 3 - 168 hours |
Technical Docs (1)
Legislation and Environmental
| Country of Origin: Country in which last significant manufacturing process was carried outCountry of Origin: | Taiwan Country in which last significant manufacturing process was carried out |
|---|---|
| Tariff No: | 85423245 |
| US ECCN: | 3A991.b.2.a |
| EU ECCN: | NLR |
| RoHS Compliant: | Yes RoHS |
| RoHS Phthalates Compliant: | Yes RoHS |
| SVHC: | No SVHC (16-Jul-2019) |
| Download Product Compliance Certificate | Product Compliance Certificate |
| Weight (kg): | .001361 |