![KEMET C0805C399B5GACTU SMD Multilayer Ceramic Capacitor, 3.9 pF, 50 V, 0805 [2012 Metric], ± 0.1pF, C0G / NP0](https://sg.element14.com/productimages/standard/en_GB/2470734-40.jpg)
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| Packaging Type | Quantity | Unit Price (excl GST): | Total |
|---|---|---|---|
| Cut Tape | 10 | S$0.420 | S$4.20 |
| Quantity | Price (inc GST) |
|---|---|
| 10+ | S$0.420 (S$0.4578) |
| 100+ | S$0.310 (S$0.3379) |
| 500+ | S$0.279 (S$0.3041) |
| 1000+ | S$0.259 (S$0.2823) |
| 2000+ | S$0.255 (S$0.2779) |
| 4000+ | S$0.192 (S$0.2093) |
Product Information
Product Overview
KEMET’s C Series C0G dielectric features a 125°C maximum operating temperature and is considered “stable”. The C0G dielectric is a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30 ppm/ºC from −55°C to +125°C.
- Operating temperature range from −55°C to +125°C
- Capacitance range includes E24 decade values from 0.5 pF up to 0.47 μF
- EIA 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220 and 2225 case sizes available
- DC voltage ratings from 10V to 250V
- Available capacitance tolerances of ±0.10pF, ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10% and ±20%
- High thermal stability
- High ripple current capability
- Extremely low ESR and ESL
- No capacitance decay with time
- No piezoelectric noise
- Capacitance change is limited to ±30ppm/°C from -55 to 125°C
- Capacitance offerings ranging from 0.5pF up to 0.47μF
Technical Specifications
3.9pF
0805 [2012 Metric]
C0G / NP0
2.01mm
Standard Terminal
125°C
MSL 1 - Unlimited
50V
± 0.1pF
C Series KEMET
1.25mm
-55°C
-
No SVHC (04-Feb-2026)
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Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Mexico
Country in which last significant manufacturing process was carried out
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